Ag Conductor Paste DT850x Series
DT850x series is a high-temperature sintered conductive paste. It is non-toxic element up to European RoHS environmental regulation (2002/95/EC).
It is designed on various ceramic thick film circuits, GPS dielectric rod antennas, thick film heaters, chip component, ozonator, etc.
Benefits
- Strong Adhesion
- Good Solderability
- Excellent Ageing Resistance
- Good Conductivity
Typical Application
- Ceramic Thick Film Circuits
- GPS Dielectric Rod Antennas
- Thick Film Heaters
- Chip Component
- Ozonator
Typical Drying Conditions
120-150℃, 8-10 minutes
Typical Firing Conditions
850℃, 10-12 minutes
Thinner
LEED DT-XS
Test | Properties |
---|---|
Viscosity (Pa.S) (Brookfield, 14#, 10rpm, 25±1℃, 2min) | 110-160 |
Fineness of Grind (µm) | ≤12 |
Screen Mesh (stainless steel/polyester mesh) | 250-325 |
Drying Condition | 150℃-150℃-150℃-120℃/200(mm/min) |
Firing Condition | 850℃/10-12min |
Sheet Resistance (mΩ/sq) | ≤2.4-5 |
Solderability (235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder) | The tin Area ≥95% |
Solder Resistance (times) (260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder) | ≥1 |
Adhesion ((N / 2×2mm2) | ≥30 |
Shelf Life | Six Months from Date of Shipment, 5-25℃ |
Related Models
Test | Properties | ||||
---|---|---|---|---|---|
DT8501 | DT8502 | DT8503 | DT8504 | DT8505 | |
Silver Content(%) | 80 | 75 | 70 | 65 | 60 |
Viscosity (Pa.S)(Brookfield, 14#, 10rpm, 25±0.5℃) | 150-250 | 100-200 | |||
Fineness of Grind (μm) | ≤12 | ||||
Screen Mesh (Stainless steel/Polyester Mesh) | 250~325 | ||||
Leveling Time | At room temperature, 2-3 min | ||||
Recommended Drying Conditions | 150℃-150℃-150℃-120℃/200(mm/min) | ||||
Recommended Firing Conditions | 850℃/10-12min | ||||
Fired Thickness(μm) | 14±2 | 8±2 | |||
Conductivity (mΩ/sq) | ≤ 2.4 | ≤ 3 | ≤ 4 | ≤ 4 | ≤ 5 |
Welderability (235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder) | The tin Area ≥95% | ||||
Solder Resistance (times) (260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder) | ≥1 | ||||
Adhesion (N/2×2mm2) | ≥30 | ||||
Shelf Life | Six Months from Date of Shipment |