Ag Conductor Paste DT850x Series

DT850x series is a high-temperature sintered conductive paste. It is non-toxic element up to European RoHS environmental regulation (2002/95/EC).

It is designed on various ceramic thick film circuits, GPS dielectric rod antennas, thick film heaters, chip component, ozonator, etc.

Benefits
  • Strong Adhesion
  • Good Solderability
  • Excellent Ageing Resistance
  • Good Conductivity

Typical Application

  • Ceramic Thick Film Circuits
  • GPS Dielectric Rod Antennas
  • Thick Film Heaters
  • Chip Component
  • Ozonator

Typical Drying Conditions

120-150℃, 8-10 minutes

Typical Firing Conditions

850℃, 10-12 minutes

Thinner

LEED DT-XS

Test Properties
Viscosity (Pa.S) (Brookfield, 14#, 10rpm, 25±1℃, 2min) 110-160
Fineness of Grind (µm) ≤12
Screen Mesh (stainless steel/polyester mesh) 250-325
Drying Condition 150℃-150℃-150℃-120℃/200(mm/min)
Firing Condition 850℃/10-12min
Sheet Resistance (mΩ/sq) ≤2.4-5
Solderability (235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder) The tin Area ≥95%
Solder Resistance (times) (260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder) ≥1
Adhesion ((N / 2×2mm2) ≥30
Shelf Life Six Months from Date of Shipment, 5-25℃

Related Models

Test Properties
DT8501 DT8502 DT8503 DT8504 DT8505
Silver Content(%) 80 75 70 65 60
Viscosity (Pa.S)(Brookfield, 14#, 10rpm, 25±0.5℃) 150-250 100-200
Fineness of Grind (μm) ≤12
Screen Mesh (Stainless steel/Polyester Mesh) 250~325
Leveling Time At room temperature, 2-3 min
Recommended Drying Conditions 150℃-150℃-150℃-120℃/200(mm/min)
Recommended Firing Conditions 850℃/10-12min
Fired Thickness(μm) 14±2 8±2
Conductivity (mΩ/sq) ≤ 2.4 ≤ 3 ≤ 4 ≤ 4 ≤ 5
Welderability (235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder) The tin Area ≥95%
Solder Resistance (times) (260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder) ≥1
Adhesion (N/2×2mm2) ≥30
Shelf Life Six Months from Date of Shipment