Ag Conductor Paste DT550x Series

DT550X series is a silver conductor paste with firing temperature around 550 degrees. It is non-toxic element up to European RoHS environmental regulation (2002/95/EC).

It is designed on alumina ceramic, quartz glass substrate, chip component, consumed hybrid integrated thick film circuit, heating element and household appliances.

Benefits
  • Strong Adhesion
  • Good Solderability
  • Excellent Ageing Resistance
  • Good Conductivity

Typical Application

  • Chip Component
  • Consumed Hybrid Integrated Thick Film Circuit
  • Heating Element
  • Household Appliances

Typical Drying Conditions

120-150℃, 8-10 minutes

Typical Firing Conditions

550℃, 10-12 minutes

Thinner

LEED DT-XS

Test Properties
Viscosity (Pa.S) (Brookfield, 14#, 10rpm, 25±1℃, 2min) 110-160
Fineness of Grind (µm) ≤12
Screen Mesh (stainless steel/polyester mesh) 250-325
Drying Condition 120-150℃/＞8min
Firing Condition 550℃/＞10min
Fired Thickness (μm) 14±2
Sheet Resistance (mΩ/sq) ≤3-5
Solderability Excellent
Solder Resistance (times) (235°C, 10s, PbSn Solder) ≥2
Adhesion/ Tape Pull (3M Scotch Tape #600) No Ag Transfer
Adhesion((N/2×2mm2) ≥20
Shelf Life Six Months from Date of Shipment

Related Models

Test Properties
DT5501 DT5502 DT5503 DT5504 DT5505
Silver Content(%) 80 75 70 65 60
Viscosity (Pa.S)(Brookfield, 14#, 10rpm, 25±0.5℃) 200±30
Fineness of Grind (μm) ＜12
Screen Mesh (Stainless steel/Polyester Mesh) 250-325
Leveling Time At room temperature, 2-3 min
Recommended Drying Conditions 120℃-150℃/＞8min
Recommended Firing Conditions 550℃/＞10min
Film Thickness (μm) 14±2
Conductivity (mΩ/sq) ≤ 3 ≤ 3 ≤ 4 ≤ 4 ≤ 5
Welderability Excellent Excellent Good Good Good
Solder Resistance (times) (235℃, 10s, PbSn Solder) ≥2
Adhesion (N/2×2mm2) ≥20
Shelf Life Six Months from Date of Shipment