Ag Conductor Paste DT4306A
DT4306A is an environmentally silver conductor paste designed for thick film circuit on stainless steel substrate. It is non-toxic element and up to European RoHS environmental regulation.
it has features of strong adhesion, good weldability, excellent aging resistance, low resistance and good printing performance.
Substrates
430 type stainless steel substrate printed with JZ4301, ceramic substrate
Benefits
- Strong adhesion
- Good welderability
- Excellent aging resistance
- Low resistance
- Good printing performance
Typical Application
- Chip Resistor
- Thick Film Hybrid Integrated Circuit
- Ceramic Capacitor
- Filter and Household Appliance
Screen Mesh
200-300 mesh
Typical Drying Conditions
150℃/10 minutes
Typical Firing Conditions
850℃/10 minutes
Test | Properties |
---|---|
Viscosity (Pa.S) (Brookfield, 14#, 10rpm, 25±1℃, 2min) | 122-155 |
Fineness of Grind (µm) | <12 |
Solid Content (%) | 86±2 |
Substrate | SUS430 substrate printed with JZ4301, Alumina ceramics substrate |
Screen Mesh | 200-300 polyester mesh or stainless steel mesh |
Leveling Time | 3min, at room temperature |
Drying Condition | 150℃/10min |
Firing Temperature | 800-900℃ |
Suggested Firing Condition | 850℃/10min |
Fired Thickness (µm) | 14-20 |
Conductivity (mΩ/sq) | ≤2.2 (Fired thickness:20µm) |
Adhesion (Vertical pull up, 2mm*2mm,Sn/Ag3.0/Cu0.5, 300+5℃) |
1. to ceraics:>30N; 2. to stainless steel: ≥18N |
Thinner | LEED DT-XS |