Ag Conductor Paste DT4306A

DT4306A is an environmentally silver conductor paste designed for thick film circuit on stainless steel substrate. It is non-toxic element and up to European RoHS environmental regulation.

it has features of strong adhesion, good weldability, excellent aging resistance, low resistance and good printing performance.

Substrates

430 type stainless steel substrate printed with JZ4301, ceramic substrate

Benefits

  • Strong adhesion
  • Good welderability
  • Excellent aging resistance
  • Low resistance
  • Good printing performance

Typical Application

  • Chip Resistor
  • Thick Film Hybrid Integrated Circuit
  • Ceramic Capacitor
  • Filter and Household Appliance

Screen Mesh

200-300 mesh

Typical Drying Conditions

150℃/10 minutes

Typical Firing Conditions

850℃/10 minutes

Test Properties
Viscosity (Pa.S) (Brookfield, 14#, 10rpm, 25±1℃, 2min) 122-155
Fineness of Grind (µm) <12
Solid Content (%) 86±2
Substrate SUS430 substrate printed with JZ4301, Alumina ceramics substrate
Screen Mesh 200-300 polyester mesh or stainless steel mesh
Leveling Time 3min, at room temperature
Drying Condition 150℃/10min
Firing Temperature 800-900℃
Suggested Firing Condition 850℃/10min
Fired Thickness (µm) 14-20
Conductivity (mΩ/sq) ≤2.2 (Fired thickness:20µm)
Adhesion (Vertical pull up, 2mm*2mm,Sn/Ag3.0/Cu0.5, 300+5℃)

1. to ceraics:>30N;

2. to stainless steel: ≥18N

Thinner LEED DT-XS