LEED-INK silicone encapsulant is a two-components room curing silicone thermal conductivity encapsulant. It is designed for long-term protection of precision electronic equipment and components in electronic industry. It is especially suitable for the sealing of electronic circuit boards and components in bad environment(such as moisture, shock and corrosive place, etc.) and the heat dissipation of high power components.

• High thermal conductivity, high and low temperature resistance(-50℃-250℃)
• Rapid curing time, and the curing time is adjustable
• Good adhesivity with materials such as metal, plastics,etc.

1) Component A and component B should use special tools separately. Do not use the tools in mixture.
2) Separately stir component A and component B fully and evenly before using.
3) Mix according to A:B=1:1, and stir it over 15min to ensure the mixing uniformity of component A and B.
4) After mixing, deaerate the paste in vacuum equipment with 10min before potting. To ensure the potting quality, it is recommended to
deaerate again after potting. If no deaeration, please put the product with 30min in room temperature before heating and curing.
5) Please finish 3) and 4) within operating time(8h).
6) Curing could be done by 80℃/15min, or 24h in room temperature.