Low Temperature Curing Conductive Adhesive   DT1204-SY-4 

LEED-INK DT1204-SY4-4 silver adhesive can be cured at low temperature. It has excellent electrical conductivity after curing, and has strong compatibility with various substrates and conductive films.

Its main components are epoxy resin, latent curing agent, neutral solvent and silver powder filler. Dispensing adhesive on the required parts of the electronic device, after heating and curing, the electrical connection can be realized.

Benefits

• One component, easy to operate
• Good conductivity temperature range
• Strong adhesion to a variety of substrates

Application

Low-temperature curing conductive adhesives are mainly used for electronic components that require curing temperature, such as mirror edge traces.

Instructions for Use

1) It is recommended to store in -40 ℃ refrigerator, the lower the temperature, the longer the product storage time, of which -40℃ can be stored for more than 6 months.
2) During storage or use, the syringe should be placed vertically, try to avoid laying down as much as possible.
3) After the product is taken out of the refrigerator, it needs to be warmed for 1 to 2 hours at room temperature in the original packaging state (the bottom plug cannot be opened).
4) Make sure the surface of the product is clean, dry, free from grease, dust and foreign matter.