Silver Palladium Conductor Paste DT08xx Series
DT08xx-H series is an environmentally palladium silver conductive paste. It is non-toxic element up to European RoHS environmental regulation (2002/95/EC).
It is designed for special circuits inner connecting and terminal electrode of high-performance thick film integrated circuits, automotive electronics, military products, etc.
Benefits
- Strong Adhesion
- Good Weldability
- Effectively Restrain from Ag ion Moving
Typical Application
- High-performance thick film integrated circuits
- Automotive electronics
- Military products
Typical Drying Conditions
120-150℃, 8-12 minutes
Typical Firing Conditions
850℃, 10-12 minutes
Thinner
LEED DT-XS
| Test | Properties |
|---|---|
| Palladium Content (%) | 0.5-30 |
| Viscosity (Pa.S) (Brookfield, DV-1, 14#, 10rpm, 25±0.5℃) | 180-420 (could be custimzed) |
| Fineness of Grind (µm) | ≤10 |
| Screen Mesh (stainless steel/polyester mesh) | 200-325 |
| Leveling Time | At room temperature, 2-3 min |
| Drying Condition | 120℃-150℃/ 8-12min |
| Firing Condition | 850℃/10-12min |
| Film Thickness (μm) | 12-16 |
| Spreading Rate(cm2/g) (fired thickness:14μm) | ～100 |
| Sheet Resistance (mΩ/sq) | ≤ 3-50 |
| Solderability | Excellent |
| Solder Resistance (260℃, 10s) | ≥ 2-5 times |
| Adhesion (N/2×2mm2) | ≥ 20-30 |
| Shelf Life | Six Months from Date of Shipment |
Related Models
| Test | Properties | ||||||
|---|---|---|---|---|---|---|---|
| DT08005-H | DT0803-H | DT0805-H | DT0810-H | DT0815-H | DT0820-H | DT0830-H | |
| Palladium Content (%) | 1 | 3 | 5 | 10 | 15 | 20 | 30 |
| Viscosity (Pa.S)(Brookfield DV-1, 14#, 10rpm, 25±0.5℃) | 180-250 | 250-350 | 320-420 | ||||
| Fineness (μm) | ≤10 | ||||||
| Solid Content (%) | 81-85 | ||||||
| Screen Mesh (Stainless steel/Polyester Mesh) | 200~325 | ||||||
| Leveling Time | At room temperature, 2-3 min | ||||||
| Recommended Drying Conditions | 150℃-150℃-150℃-120℃ / 200(mm/min) / 8-12min | ||||||
| Recommended Firing Conditions | 850℃/10-12min | ||||||
| Film Thickness(μm) | 11-15 | ||||||
| Spreading Rate(cm2/g)(fired thickness:14μm) | ～100 | ||||||
| Conductivity (mΩ/sq) | ≤ 3 | ≤ 4 | ≤ 6 | ≤ 10 | ≤ 20 | ≤ 30 | ≤ 50 |
| Solderability | Excellent | ||||||
| Solder Resistance (times) (260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder) | ≥ 2 | ≥ 2 | ≥ 3 | ≥ 4 | ≥ 4 | ≥ 5 | ≥ 5 |
| Adhesion (N/2×2mm2) | ≥30 | ≥20 | |||||
| Shelf Life | Six Months from Date of Shipment | ||||||